The Flash DSC 1 allows you to prepare samples with defined structures such as occur during rapid cooling in injection molding processes. The application of different cooling rates influences the crystallization behavior and structure of the sample.
The use of high heating rates means that the material can be analyzed without interference from reorganization processes – there is no time for them to occur. Flash DSC is also the ideal tool for studying crystallization kinetics.
Features and benefits of Flash DSC 1:
- Ultra-high cooling rates – allow materials with defined structural properties to be prepared
- Ultra-high heating rates – reduce measurement times and prevent reorganization processes
- Fast response sensor – enables the kinetics of extremely fast reactions or crystallization processes to be studied
- High sensitivity – low heating rates can be used; the measurement range overlaps with that of conventional DSC
- Wide temperature range – measurements can be performed in the range –95 to 450 °C
- User-friendly ergonomics and functionality – sample preparation is quick and easy
MEMS-based DSC Sensor Technology –Unsurpassed Heating and Cooling RatesThe heart of the Flash DSC is the chip sensor based on MEMS technology (MEMS = Micro-Electro-Mechanical Systems).
In Flash DSC, the sample is placed directly onto the MultiSTAR
e chip sensor. A patented dynamic power compensation circuit allows measurements to be performed with minimum noise at high heating and cooling rates.
MultiSTAR UFS1 SensorThe Full Range UFS 1 sensor has 16 thermocouples and exhibits high sensitivity and excellent temperature resolution. The MEMS chip sensor is mounted on a stable ceramic substrate with electrical connections.
SensitivityThe high sensitivity results from the use of 16 thermocouples, 8 each on the sample and reference sides. The thermocouples are arranged symmetrically around the sample area in a star shape so that temperatures are measured with great accuracy. The outstanding sensitivity that results allows measurements to be performed at low heating and cooling rates.